IT之家 9 月 29 日消息，TomsHardWare 发现，英特尔本月初公开了一项关于 CPU 封装的新专利，提出将 Micro LED 灯珠直接集成到处理器内部的想法。
这意味着，将来处理器表面不仅可以表明 RGB 灯效，还可以自定义点亮 Logo 或文字，或者依据处理器负载、温度或执行状态实时改变光效。
这项专利于 2022 年提交，并于本月正式公开。该专利描述了一种基于玻璃基板（Glass Substrate）和穿玻璃通孔（TGV）的封装思路，可将 Micro LED 灯珠与半导体裸片直接连接（由 CPU 核心直接负责供电和信号调度），使封装表面的灯光可以依据处理器负载、温度或特定指令实时变化。
英特尔在专利中表示，这些 Micro LED 可以作为电子设备的装饰性组件（仅用于给出动态光效），也可充当指示灯，使设备在执行特定任务时改变灯光成效。
其中，一个较引人关注的设想是在 CPU 封装表面点亮文字或标识。英特尔认为，处理器表面的字样可以借助 Micro LED 发光表明。不过理论上来说，绝大多数使用者在安装 CPU 后都会继续安装散热器。至于这一灯光外观如何展现，英特尔并未给出具体方式。
从公开的示意图来看，玻璃基板位于两层封装基板之间，半导体裸片部分嵌入玻璃基板，裸片背面保持外露；在其他实施方式中，裸片也可以完全嵌入基板内部。Micro LED 可直接连接至半导体裸片，也可借助纳米线连接，而 TGV（玻璃通孔，用于在玻璃基板中建立垂直电气连接）则负责在玻璃基板内传输电源和信号。
英特尔介绍称，这种封装结构使用两层氮化硅材料构建，并与玻璃基板结合。公司近年来持续推进玻璃基板工艺研发，并认为相比传统有机基板，其互连密度可提高约 10 倍，有助于兼容更复杂的芯片封装外观。
当下，这项工艺仍停留在专利阶段，并不意味着相关机型已经进入量产。英特尔四年前提交的这一专利如今才正式公开，将来是否会有搭载封装级 Micro LED 的处理器机型上市，仍有待进一步观察。
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On September 29, IT之家 reported that TomsHardWare found Intel had published a new patent on CPU packaging earlier this month, proposing the idea of directly integrating Micro LED beads inside the processor.
This means that in the future, processor surfaces could not only display RGB lighting effects, but also light up custom logos or text, or change lighting effects in real time based on processor load, temperature, or execution state.
The patent was filed in 2022 and officially published this month. It describes a packaging approach based on a glass substrate (Glass Substrate) and through-glass vias (TGV), which can directly connect Micro LED beads to semiconductor dies (with the CPU cores directly responsible for power supply and signal scheduling), enabling the lighting on the package surface to change in real time based on processor load, temperature, or specific instructions.
In the patent, Intel states that these Micro LEDs can serve as decorative components for electronic devices (used solely to provide dynamic lighting effects), and can also act as indicator lights, allowing devices to change their lighting effects when performing specific tasks.
Among these, a particularly attention-grabbing idea is to light up text or logos on the CPU package surface. Intel believes that lettering on the processor surface can be illuminated by Micro LEDs. However, in theory, most users would still install a cooler after installing the CPU. Intel did not provide a specific way in which this lighting appearance would be presented.
From the published schematic, the glass substrate is positioned between two package substrate layers, with the semiconductor die partially embedded in the glass substrate and the back side of the die remaining exposed; in other embodiments, the die may also be fully embedded within the substrate. Micro LEDs can be connected directly to the semiconductor die or connected via nanowires, while TGVs (through-glass vias used to establish vertical electrical connections inside the glass substrate) are responsible for transmitting power and signals within the glass substrate.
Intel explained that this packaging structure is built using two silicon nitride material layers and combined with a glass substrate. The company has been advancing research and development of the glass substrate process in recent years, and believes that, compared with traditional organic substrates, its interconnect density can be increased by about 10 times, helping accommodate more complex chip packaging appearances.
At present, this process is still at the patent stage and does not mean that relevant models have entered mass production. Intel's patent, submitted four years ago, has only just been officially published, and whether processor models featuring package-level Micro LEDs will be launched in the future remains to be seen.
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