E Ink Teams Up with Ecosystem Partners to Develop Next-Generation ePaper Shelf Labels for Retail Sig

E Ink announced it is collaborating with ecosystem partners Realtek Semiconductor (Realtek), Integrated Solutions Technology (IST), and Chipbond Technology Corporation (Chipbond) to develop the System on Panel (SoP) architecture. This technology will be integrated into the next-generation electronic shelf label (ESL) jointly developed with the system integrator, SOLUM. In order to simplify the material structure of ESL, the partners say this collaboration aims to bring a sustainable solution via reduced material usage, lower power consumption and simplified production processes.

Realtek will supply low-power Bluetooth System on Chip (SoC) technology, while E Ink provides “technical expertise and knowledge of ePaper displays and embedding integrated circuits (IC) directly onto glass and flexible substrates.” The latest IC technology developed in collaboration with IST and Chipbond utilizes a new Conical Granule Au bump (CGA bump) to replace traditional gold bumps in the packaging process. This “significantly reduces the amount of gold material necessary in IC packaging and testing, providing reliable, stable and competitively priced products.” Global ESL system integrator, SOLUM, will also join in the development of the next generation ESL solution. The aim is to introduce thinner, lighter, and more energy-efficient ESLs into the retail market as soon as possible.

According to E Ink, the SoP technology integrates IC, panel and system production together, reducing processes, materials and product volume, and lowering energy consumption. It establishes the system directly on the glass or flexible substrate, eliminating the need for additional printed circuit boards (PCBs). Major goals for the collaboration focus on overcoming challenges related to IC bonding, reducing line resistance, integrating antennas and utilizing Anisotropic Conductive Film (ACF) processes.

ESLs say they bring significant carbon reduction to retail environments. Based on the most commonly used 3-inch ePaper labels, approximately 600 million units have been installed globally in the past seven years. If the information is updated four times a day, the carbon dioxide emissions generated by using paper labels are 32,000 times higher than ePaper labels. Considering 30 million 10-inch electronic shelf labels worldwide, and using them continuously for five years, the carbon dioxide emissions from LCD displays are 12,000 times higher than ePaper displays in terms of power consumption. Compared to disposable printed paper, the carbon dioxide emissions from paper are “60,000 times higher than ePaper displays.”

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